Heat Flux Sensors / Micro-Foil® HFS Array
MICRO-FOIL® HEAT FLUX SENSOR with ARRAY OPTION
27160
RdF’s 27160 Heat Flux Sensor can be manufactured in strips and arranged in arrays or groups facilitating the measurement of average heat flux over large non-uniform areas.
Features
Low thermal impedance
High Sensitivity
Fast response
Wide temperature range
Thin and flexible
RdF’s Micro-Foil® Heat Flux Sensors feature true iso-thermal properties. Thermal losses are kept to a minimum and highly accurate readings are obtainable because of their extremely thin construction (Low thermal impedance). The planar heat flux sensors self-generate an interchangeable, linear mV measurement of heat flux in or out by all modes: convection, conduction or radiation. Positive or negative output defines the direction of the net total heat flux measured at up to 150°C.
The mV or mV output is proportional to the heat flux passing through the sensor thickness. Their sensitivity is controlled by the thickness of the thermal barrier and the number of thermocouple junctions within the sensor.
Exclusive features include the interchangeable mV output and a conformable, sealed configuration for lamination or surface mounted application. Edge connections can be soldered. Adhesive backing and addressable wide area sensor arrays are available.
Temperature control can be enhanced by reacting to heat flux changes detected before temperature can change. Building controls systems can add real time reaction to solar and wind loads.
Performance Specifications
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Operating Temperature Range Heat Flow Range Typical Sensitivity |
Typical Response Time Typical Thermal Impedance Typical Thermal Capacitance |
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Teflon® and Kapton® are registered trademarks of Dupont |
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RdF’s Micro-Foil® Heat Flux Sensors feature true iso-thermal properties. Thermal losses are kept to a minimum and highly accurate readings are obtainable because of their extremely thin construction (Low thermal impedance). The planar heat flux sensors self-generate an interchangeable, linear mV measurement of heat flux in or out by all modes: convection, conduction or radiation. Positive or negative output defines the direction of the net total heat flux measured at up to 150°C.
The mV or mV output is proportional to the heat flux passing through the sensor thickness. Their sensitivity is controlled by the thickness of the thermal barrier and the number of thermocouple junctions within the sensor.
Exclusive features include the interchangeable mV output and a conformable, sealed configuration for lamination or surface mounted application. Edge connections can be soldered. Adhesive backing and addressable wide area sensor arrays are available.
Temperature control can be enhanced by reacting to heat flux changes detected before temperature can change. Building controls systems can add real time reaction to solar and wind loads.
Ordering Specifications
Adhesive backing also available on request.
| 27160 Low Cost , Heat Flux Sensor | ||||||||||
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CALLIBRATION |
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LEAD Wires (Specify in inches) N No lead Wire L 120 inches Standard |
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Number of Element Array A01 Single Element AXX (02 thru 21 elements)(ex. A10 = 10 Element Array) |
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Typical write-up for 27160 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Drawing Dimensional
